Precise Substrate Thinning | Polishing

Fast and Precise Substrate Thinning | Polishing With Quick Results

Precise Substrate Thinning | Polishing

Proper sample preparation is critical in getting useful results.

Sage Analytical Laboratories has employed the use of a high precision milling station to thin and polish devices with unparalleled success and speed.

The Ultratech ASAP milling tool enables our highly experienced personnel to open any package, and prepare for emission techniques while keeping the sample in working condition.

By thinning samples, certain light emission techniques can achieve higher resolution, and overall better emission. With the automated nature of the milling and the variety of bits enable, high speed sample preparation is realized from the roughest of surfaces to optical finishes. With our speedy know-how, we drive quick turn around with dead-on results.

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