Quick Dye and Pry Process
Sometimes, simple methods are the best.
Using a standard dye and pry technique, Sage Analytical can very quickly gain insight to mechanical failures in interconnects. With this standard method, a complete quick visual will give you the information you need to evaluate your physical connection issues.
The obvious encroachment of dye into an area it isn’t desired can show packaging flaws, solder joint issues, delaminations and other physical voiding.
Submit your questionable packages to Sage Analytical Lab for incredible turn around time. When a full analysis isn’t needed, we can provide just the information necessary to you to speed mitigation along.