CSAM Failure Analysis Evaluation

Accurate CSAM Evaluation With Quick Turn-Around

Accurate CSAM Evaluation Analysis

With our modern OKOS Scanning Acoustic Microscope (SAM) in B or C-mode (CSAM), Sage Analytical Laboratories can non-destructively image within your package or bonded wafer.



CSAM has many uses in the field such as:

    • Voiding in a package or laminate
    • Voiding in underfill
    • Delaminations
    • Die cracking
    • Contact non-wets
    • Damaged C4s and interconnects
    • Wirebond disconnects
    • Ball bond disconnects
    • Counterfeit Detection
    • Product Reliability
    • Process Validation
    • Product Inspection
    • Quality Control

Once the area of interest has been identified, we are able to cross section mechanically or with our Dual-Beam Focused Ion Beam (FIB) to determine the precise details of the observed anomaly.

Sage has a full complement of SAM transducers from the low frequency range to high frequency to support your needs. Whether you need SAM top scans with high spatial resolution or thru scans with a high degree of sample penetration, Sage has the transducer you need to get the job done quickly and accurately.

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