3D CT Sub-Micron X-Ray Analysis

Driven by the development of more sophisticated packaging and subtler defects, the applications of 3-dimensional non-destructive techniques have become crucial in standard analysis flows.

2-dimensional X-ray captures lack the depth, versatility, and angles necessary for most modern analyses.

The answer to this problem is the new high resolution sub-micron 3D/CT X-ray system at Sage Analytical Lab.

With this technique, we are able to identify and isolate fail signatures including:

• • BGA fatigue
  • BGA cracking
  • BGA voiding
  • C4/Bump cracking
  • Wire bond shorting
  • Die attach issues
  • Copper tracing in laminates, substrates and boards
  • Passive component integrity and placement
  • Various other metal defects

All of these defects may be detected and imaged in 3D before any destructive techniques that may produce a questionable result are even considered. This guarantees an answer that removes any doubt of sample preparation or mishandling issues.

These 3D images can be generated by rotating the device 360 degrees and capturing 2D images along all axes during rotation. These individual images are then merged into a single 3D file (called a tomography). From this file, innumerable virtual cross-sections may be created and viewed in minutes, slicing from any angle desired. This removes the costly time and physical resources needed for multiple tedious physical cross-sections of these devices.

Using the Yxlon FeinFocus Cougar high magnification, high power (160kV) X-Ray system at Sage Analytical equipped with OEM micro-focus and multi-focus tubes with closed loop central feedback at the source enables engineers to view these reconstructions in as little as three (3) minutes. Couple this with the high speed digital detector, FGUI extensions, BGA void calculation software, and EZ screen viewing, enables analysis that can take up to days in a conventional lab to be performed in a matter of minutes.