Okos Scanning Acoustic Microscope (SAM)

OKOS Industry Leading Scanning Acoustic Microscope (SAM)

Okos scanning acoustic microscope (SAM)

The scanning acoustic microscope (SAM) is a non-invasive and non-destructive tool that can be used to image the internal features of a sample using sound energy through the use of ultra-sonic transducers in water. The transducers transmit pulses of sound waves through the water and sample, and receive the reflected sound pulses (echo) that come from discontinuities and disturbances in the sample to create an image. With the complexity of modern packaging comes a plethora of new fail signatures that are hard to isolate using conventional techniques. The scanning acoustic microscope (SAM) is very sensitive to delamination, cracks, and voids in sub-micron thicknesses which are difficult to identify using X-Ray radiography.

With Sage Analytical Lab’s new Okos scanning acoustic microscope (SAM), multiple fail types can be detected and isolated in a non-destructive manner.

These fails include but are not limited to:

    • Voiding in a package or laminate
    • Voiding in underfill
    • Delaminations
    • Die cracking
    • Contact non-wets
    • Damaged C4s and interconnects
    • Wirebond disconnects
    • Ball bond disconnects

As per the Okos website, other benefits and specifications are as follows:


    • Counterfeit Detection
    • Product Reliability
    • Process Validation
    • Vendor Qualification
    • Product Inspection
    • Quality Control
    • Failure Analysis
    • Research and Development


    • Windows XP & 7 OS support
    • High frequency Digitizers with hardware processing (up to 12 GHz)
    • Stream to Disk, bypassing memory limitations – a full JEDEC tray scan at 5 micron resolution
    • SALI (Scanning Acoustic Layer Imaging) with 100+ data gates for multi zone inspection in a single scan
    • Simultaneous multiple B-scan gates
    • Multiple attributes per data gate
    • Simultaneous Pulse-Echo from top and bottom of device (with special fixture)
    • Thickness measurement (peak to peak, front surface to front surface, etc)
    • Transducer profiling capability for calibration
    • Concurrent Pulse Echo and Through Transmission
    • Dual channel configuration for high throughput (2x)
    • Configurable production mode interface
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