In Depth IC Process Evaluation | Documentation
Sage can provide extensive non-destructive and destructive physical analysis (DPA) options in order to evaluate your IC process or find out how a competitor is making theirs.
With high resolution imaging and state of the art deconstruction techniques, the most minute details can be garnered from a product.
High-resolution photo documentation with clearly labeled physical measurements are provided to the customer, in order to facilitate a reconstruction, full understanding of a problem, or current state of the production quality. SAGE works with the customer to customize a DPA solution to each need and to any extent, from basics to in depth analysis.